RTU 2016 Question Paper Semester VIII Electronics and Communication Engineering MEMS and NanoTechnology

031 b*. !=o,* ra (\I 2016 \d B.Tech. vIII Semester (Main) Examination,ApriuMry -€ Electronics and Comrnunication Engg' Fd € 8EC3A MEMS and NanotechnologY Common with 8EI4'2A Maximum Marks : 80 Time : 3 Hours Min. Passing Marks : 24 Instructions to Csnd"idates: each unit' All questians Atternpt any live questions, selecting one question from wherever necessary' csrry equal-marlcs. (schematie diagrams must be sltown stated clearly') Units of Any data you feel missing suitably be assumed and qltantitiesused/calculatedrnustbestatedclearly. Unit - I up approach in 1. a) Give the differenee between top down and bottom {8} nanotechnology with suitable diagram Effect in super b) what do you rnean by superconduetor? Expiain Massiner {8} conductor OR Write its advantages on device 1. a) What do youmeanby single electrontunneiing. (8) scaling (8) b) Write short notes on Graphenes and CNT Unit - il 2. a) Discuss various cvD techniques for deposition of s,o' Also state the parameter on wtrictr ip, Otpo*itiot' depends {8) proximity printing and b) What dc- yau mean by optical lithography? Expiain (8) compare it with contaet and projection printing OR process' Write prone 2. a) What d* you mean by etching in device manufacturiilg (8) and cones of wet and dry etching write benefit and b) what is gettering? Exptain intrinsic gettering proeass' t8) advantage of gettering

Unit - III 3' Briefly explain the difference between reighley and Raman scattering. Which type of scattering results in a longer wavelength than the incident light, Reighley Ramin stokes or Raman anti-stokes (16) OR 3. a) What do you understand by dynamic light scattering(DlS) technique. Also write its application ? (8) b) Write the difference between SEM and TEM (8) Unit - IV 4' a) Explain the concept of quantum mechanics of low dimensional structure (8) b) Write the difference between quantum dots, quantum wires and quantum wells ? (S) OR 4. a) What do you mean by Nano biology (8) b) What are Nano medicines? What approach has been used for developing nano medicines (8) Unit - V 5' a) Given the comparison between microelectronics and microsystems (g) b) Write about wire bonding and flip chip assembly process used in packaging of MEMS (8) OR 5. a) What do you mean by active substrate materials (8) b) Explain about various type package used in MEMS technology (8) 888023 Q)